PCB 制造工艺简述

PCB 制造工艺简述
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PCB

PCB

PCB

. PCB

1.1 PCB PCB PCB PCB 1.1 1.2 PCB 1.

1903

Mr. Albert Hanson 1.2

"

"(Circuit)

PCB 2. 1936

Dr Paul Eisner print-etch (photo image transfer) 1.3 PCB PCB 1.3.1 PCB A. a. / b. Copper Inver-copper B. a. b. c. C. a. b. c. D. 1.5 1.6 1.7 / / PCB / Rigid PCB Flexible PCB 1.3 Rigid-Flex PCB 1.4 ceramic

PCB

Polyamide BT/Epoxy

/

/

,

1.8 BGA.

1.3.2 A. 1.9 1

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PCB

PCB

B. C.

1.10 1.11 IC PCB

.

2.1. PCB PCB Shop Bare Board (Assembly) Turn-Key Drawing, Artwork, Specification PCB : 1 2 3 4 (5) 6

Micro-Modifier CAM(Computer Aided Manufacturing) DFM(Design For Manufacturing) output

2.2.

A Gerber file PCB CAD Scientific Gerber System CAD Drawing B. RS-274D Gerber Format Industries Association) 2.Coordinate data C. RS-274X RS-274D RS-274D Code RS-274X Parameters 2 EIA STANDARD RS-274D(Electronic 1.Function Code imaging G codes, D codes, M codes Film Gerber Format Output Data 1960 Gerber

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PCB

PCB

extended Gerber format D. IPC-350 IPC-350 IPC ,PCB SHOP E. Laser Plotter 2.1, Gerber format IPC 350 format Artwork neutral format, NC Drill Program,Netlist, PCB CAD/CAM Laser Plotter , .

F. Aperture List and D-Codes 2.1 2.2, , Aperture 2.1

2.3. 2.3.1 PCB SHOP . , Bare Board

2.3.2 .

A. B. BOM-Bill of Material BOM Laminate Mask Legend Prepreg Finish OSP Copper foil , ,

.

Solder

3

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PCB

PCB

C. , ECO (Engineering Change Order) . D.

. .

,

Check

.

30~60% Layout PCB PANEL a. b. c. d. e. , piece . PANEL Layout

2.3.3

A. . B. CAD/CAM

(Flow Chart) : 2.3 2.4 .

4

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PCB

PCB

a.

Gerber Data PCB CAM PCB Layout

CAM IPC-350 . ,

apertures CAM

shapes NC Routing NC

Router, Shapes Aperture code b. shapes

thermal pad

Check list check list

c. Working Panel PCB Layout

.

30~60% Layout PCB PANEL Layout

1. 2. 3. 4. 5 5 piece . PANEL

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PCB

PCB

,

working Panel

d. Artwork Laser Plotter PCB . CAM D-Code

1. 2. 3. 4.

, e. DFM

Routing Design for manufacturing .PCB layout Lay-out 2.5,

NC Routing PCB

PCB PAD

PAD

PCB PCB Lay-out 2.6 . 6

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PCB

PCB

C. Tooling AOI Netlist Net list ..AOI CAD reference Fixture AOI

2.4 , ,PCB Lay-out , PCB , , . , , . , , , , , , ,

.

Copper-clad Laminate , , . fiber . 3.1 3.1.1 3.1.1.1 , 3.1 ( . Resin Copper foil ) Glass Composite material , , CCL :

Resin , Polyamide Phonetic PTFE Epoxy

TEFLON B Thermosetted Plastic Resin 3.1.1.2

Polytetrafluorethylene Bismaleimide Triazine BT

Phenolic Resin phenol

Formaldehyde

Formalin 3.1 7

Crosslinkage 1910 Bakelite

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PCB

PCB

Bakelite (NEMA-Nationl Electrical Manufacturers Association) , "X" "X" Punchable "C" "P" cold punchable "FR" (Flame Retardent) (Flame resistance) 25 : A a. XPC Grade UL94 b. FR-1 Grade FR-1 c. FR-2 Grade V-0 V-1 FR-1 FR-1 FR-1 FR-1 FR-2 ,FR-2 V-2 V-0 XPC Grade VTR XPC Grade HB XPC Grade UL94 , .062in "X" NEMA

XXXPC

FR-2

B. a. FR-4 b. FR-4 (Silver Paste

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